After LOADS of rumours surrounding the Glaze3D chipset developed by Finland's Bitboys it seems something really hot is coming at us. NVNews are reporting that a Finnish IT print publication called Micro PC has an article about the Bitboys chip in their latest issue: Read the ripped & translated article under read more.
Bitboys chip gets to the silicon Limits of the modern silicon process are being tested in gfx chip development. Noormarkku based Bitboys was plannig to introduce PC-display adapters based on companys own graphics technology a year ago in Comdex. Instead they gave up the whole silicon implementation of chip, called Glaze3D at the time. A new, further developed design is in the silicon process at the moment. Also a follower to this chip is being designed. Chip under manufacturing has increased embedded memory, leading to the total size of 12 MB. Also the internal bus has been doubled to the width of 1024 bits. "I know we have been shallow in our comments, but I can reveal that chip design is complete and chip is being manufactured", says Juha Taipale, general manager. One aspect making the chip design harder was difference between embedded ram and logic. Embedded ram benefits from large capasitance (sp?) of the chips silicon, when on the other hand, it's vice versa with the logic. Large capacitance allows the use of small size memory cells, but same time increases the size chips area used for logic operations. "In a sense, our graphics process is as hard to manufacture as state of art main cpu's.", comments ASIC-designer Harri Syrjä.
Bitboys chip gets to the silicon Limits of the modern silicon process are being tested in gfx chip development. Noormarkku based Bitboys was plannig to introduce PC-display adapters based on companys own graphics technology a year ago in Comdex. Instead they gave up the whole silicon implementation of chip, called Glaze3D at the time. A new, further developed design is in the silicon process at the moment. Also a follower to this chip is being designed. Chip under manufacturing has increased embedded memory, leading to the total size of 12 MB. Also the internal bus has been doubled to the width of 1024 bits. "I know we have been shallow in our comments, but I can reveal that chip design is complete and chip is being manufactured", says Juha Taipale, general manager. One aspect making the chip design harder was difference between embedded ram and logic. Embedded ram benefits from large capasitance (sp?) of the chips silicon, when on the other hand, it's vice versa with the logic. Large capacitance allows the use of small size memory cells, but same time increases the size chips area used for logic operations. "In a sense, our graphics process is as hard to manufacture as state of art main cpu's.", comments ASIC-designer Harri Syrjä.
