Infineon today announced that it released first engineering samples of new high density DDR SDRAM modules. These new modules are unregistered and the 1GB module is targeted @ high-end PC's and workstations whereas the 2GB module is aimed for the server market. The new modules are the industry?s first commercial high-density modules based on monolithic (single-chip) 512Mb memory components. Infineon will again showcase these @ Jedex Conference.
The 1GB unbuffered DIMM uses 18 pieces of 512Mb components configured as 64M x 8. The 2GB registered DIMM uses 36 pieces of stacked 512Mb components organized 256M x4 which means it can support chip-kill, a feature now found on advanced memory controller systems. Both of the new DIMMs are 184 pin, 2.5V devices, available in speed grades for PC1600 and PC2100. Source: Infineon
The 1GB unbuffered DIMM uses 18 pieces of 512Mb components configured as 64M x 8. The 2GB registered DIMM uses 36 pieces of stacked 512Mb components organized 256M x4 which means it can support chip-kill, a feature now found on advanced memory controller systems. Both of the new DIMMs are 184 pin, 2.5V devices, available in speed grades for PC1600 and PC2100. Source: Infineon
