Materials engineer Deborah D.L. Chung at the University at Buffalo, N.Y. has invented a new thermal paste that will help solve the problem of overheating in high-performance personal computers and other electronics. In comparative laser-flash testing, Chung's thermal paste - composed of carbon-filled organic material - performed better than the leading thermal pastes currently on the market. The results of the testing and the makeup Chung's paste will be described in a forthcoming issue of the journal Carbon.

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